Table 1

Characterization of the films prepared using dipping approach
Number of bilayers Roughness Thickness Contact angle
10-4M 10-3M 10-4M 10-3M 10-4M 10-3M
μ σ μ σ μ σ μ σ μ σ μ σ
20 9.47 0.15 48.98 1.33 23.67 4.24 120.33 5.34 48.75 1.49 0.36 0.21
40 11.03 0.695 56.78 1.45 35.33 0.71 184.12 7.78 65.50 1.55 3.31 0.81
60 17.51 1.16 105.5 2.34 75.11 1.41 365.03 7.07 30.12 0.91 0 0
80 19.05 0.29 123.93 3.51 82.07 0.70 461.06 0.35 28.51 1.66 0 0
100 18.53 1.62 205.23 9.79 112.02 5.65 486.07 5.65 28.02 1.41 0 0

Elosua et al.

Elosua et al. Nanoscale Research Letters 2013 8:539   doi:10.1186/1556-276X-8-539

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