Table 1

Deposition parameters of different materials
Materials Target/granules Methods Vacuum (Torr) Ar gas (SCCM) Power (Watt) Deposition rate
W W target RF sputtering 1 × 10-5 25 150 12 nm/min
GeOx Ge target RF sputtering 2 × 10-5 25 50 5.3 nm/min
Cu Cu granules Thermal evaporator 8 × 10-6 - - 2-3 Å/s
Al Al granules Thermal evaporator 8 × 10-6 - - 2-3 Å/s

Rahaman and Maikap

Rahaman and Maikap Nanoscale Research Letters 2013 8:509   doi:10.1186/1556-276X-8-509

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