Figure 10.

AFM topography image, surface ditch height, and residual stress. (a) AFM three-dimensional topography image of the unpolished Cu foil specimen. (b) Surface ditch height and residual stress of unpolished Cu foil, polished Cu foil, and Cu film specimens.

Hu et al. Nanoscale Research Letters 2013 8:445   doi:10.1186/1556-276X-8-445
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