Figure 1.

Schematic depiction of the fabrication process. (a) Pretreated silicon wafer, (b) assembly of PS sphere arrays, (c) RIE of the PS spheres, (d) deposition of the Ag film, (e) removal of the PS spheres, (f) metal catalytic etching, (g) removal of the residual silver, (h) two-step dry oxidation, and (i) self-limiting oxidation.

Su et al. Nanoscale Research Letters 2013 8:405   doi:10.1186/1556-276X-8-405
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