Figure 3.

Process flow. The fabrication process flow of the device in Figure 1. (a) Sample. (b) Electron beam patterning of the grooves in resist. (c) Dry etching of the corrugations. (d) Gluing the SiO2 substrate. (e) Template stripping. (f) Resist coating. (g) Patterning of the slit. (h) Dry etching of the slit.

Rahomäki et al. Nanoscale Research Letters 2013 8:326   doi:10.1186/1556-276X-8-326
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