Table 2

Computational parameters used in the MD simulation model
Material
Substrate: copper Tool: diamond (rigid) Indenter: diamond (rigid)
Potential function EAM potential function None None
Dimensions 75a × 35a × 50a Rake angle, 0° Hemisphere indenter
(a is the lattice constant, 0.3614 nm) Clearance angle, 7° Radius, 50.0 Å
Time step 0.1 fs
Original temperature 296 K
Number of atoms 525,000 21,823 36,259
Cutting depth 1.0 nm
Cutting velocity [ī00] on (010) surface 200 m/s
Indentation depth 2.0 nm
Indentation velocity [010] on (010) surface 50 m/s

Zhang et al.

Zhang et al. Nanoscale Research Letters 2013 8:211   doi:10.1186/1556-276X-8-211

Open Data