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Resolution: standard / high Figure 2.
InAs deposited on a 90-nm-wide-patterned Si (001) substrate with an aspect ratio of
2.5. (a) Cross-sectional TEM image, (b) selected-area electron diffraction pattern taken near the trench top region, and
(c) cross-sectional TEM cleft images along the
direction of the InAs nanofins for InAs deposited on a 90-nm-wide-patterned Si (001)
substrate with an aspect ratio of 2.5. The dislocation interruption is marked with
a dashed line, and the dislocations are marked with arrows.
Hsu et al. Nanoscale Research Letters 2012 7:642 doi:10.1186/1556-276X-7-642 |