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Microstructure and adhesion characteristics of a silver nanopaste screen-printed on Si substrate

Kwang-Seok Kim1, Yongil Kim2 and Seung-Boo Jung2*

Author affiliations

1 SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 440-746, Republic of Korea

2 School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, 440-746, Republic of Korea

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Citation and License

Nanoscale Research Letters 2012, 7:49  doi:10.1186/1556-276X-7-49

Published: 5 January 2012


The microstructural evolution and the adhesion of an Ag nanopaste screen-printed on a silicon substrate were investigated as a function of sintering temperature. Through the two thermal analysis methods, such as differential scanning calorimeter and thermo-gravimetric analysis, the sintering conditions were defined where the temperature was raised from 150°C to 300°C, all with a fixed sintering time of 30 min. The microstructure and the volume of the printed Ag nanopaste were observed using a field emission scanning electron microscope and a 3-D surface profiler, respectively. The apparent density of the printed Ag nanopaste was calculated depending on the sintering conditions, and the adhesion was evaluated by a scratch test. As the sintering temperature increased from 150°C to 300°C, the apparent density and the adhesion increased by 22.7% and 43%, respectively. It is confirmed that the printed Ag nanopaste sintered at higher temperatures showed higher apparent density in the microstructural evolution and void aggregation, resulting in the lower electrical resistivity and various scratched fractures.

silver nanopaste; screen printing; sintering; density; adhesion.