Figure 8.

SEM (a, b, c) and EDX point analyses (d, e, f) of the porous copper membrane. The porous copper membrane was formed by displacement deposition of copper on PS4 for 7200 s from the solution of improved wettability; porous copper membrane was analyzed in cross section (a, d), top (b, e), and bottom (c, f).

Bandarenka et al. Nanoscale Research Letters 2012 7:477   doi:10.1186/1556-276X-7-477
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