Figure 5.

Optical micrographs of epoxysiloxane resists on bare silicon wafer. (a) Ruptured film of the epoxysiloxane resist with a viscosity of 37 mPa s and water contact angle of 98.9° formed in 10 min after spin coating and (b) uniform film of the epoxysiloxane resist with a viscosity of 112 mPa s and water contact angle of 80.6° kept unbroken for 1 h after spin coating.

Zhang et al. Nanoscale Research Letters 2012 7:380   doi:10.1186/1556-276X-7-380
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