Table 1 |
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| Deposition conditions, particle density, and size of metal particles on Si wafers | |||||
| Metal | Metal salt concentration(×10−3 mol dm−3) | Solution temperature (K) | Deposition time (s) | Average particle density (×1011 cm−2) | Average particle size (nm) |
| Ag | 1.0 | 278 | 5 | 1.8 | 9 |
| Au | 0.5 | 278 | 10 | 5.2 | 5 |
| Pt | 1.0 | 313 | 90 | 0.066 | 50 |
| Rh | 1.0 | 313 | 120 | 0.048 | 60 |
Metal salt for Pt deposition was potassium tetrachloroplatinate (II).
Yae et al. Nanoscale Research Letters 2012 7:352 doi:10.1186/1556-276X-7-352
