Table 1

Deposition conditions, particle density, and size of metal particles on Si wafers
Metal Metal salt concentration(×10−3mol dm−3) Solution temperature (K) Deposition time (s) Average particle density (×1011cm−2) Average particle size (nm)
Ag 1.0 278 5 1.8 9
Au 0.5 278 10 5.2 5
Pt 1.0 313 90 0.066 50
Rh 1.0 313 120 0.048 60

Metal salt for Pt deposition was potassium tetrachloroplatinate (II).

Yae et al.

Yae et al. Nanoscale Research Letters 2012 7:352   doi:10.1186/1556-276X-7-352

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