Figure 3.

Carrier lifetimes of Si wafers with different Mg thicknesses and sintering steps. Mg200, thickness of Mg is 200 Å; Mg300, thickness of Mg is 300 Å; Mg400, thickness of Mg is 400 Å.

Lee et al. Nanoscale Research Letters 2012 7:32   doi:10.1186/1556-276X-7-32
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