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Applications of multi-walled carbon nanotube in electronic packaging

Cher Ming Tan1*, Charles Baudot12, Yongdian Han3 and Hongyang Jing3

Author affiliations

1 School of Electrical and Electronic Engineering, Nanyang Technological University, Jurong, 639798, Singapore

2 ST Microelectronics Asia Pacific Pte Ltd, 7 Serangoon North Avenue 5, Serangoon, 554812 Singapore

3 School of Materials Science and Engineering, Tianjin University, Tianjin, 300072, China

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Citation and License

Nanoscale Research Letters 2012, 7:183  doi:10.1186/1556-276X-7-183

Published: 9 March 2012


Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work.