Figure 2.

Typical stress-strain curves of the simulated samples. (a) Twin-free Cu samples and (b) NT Cu samples. The diameter d of the central void varies from 2 to 16 nm, while the TB spacing is kept at 25 nm.

Zhang et al. Nanoscale Research Letters 2012 7:164   doi:10.1186/1556-276X-7-164
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