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Crosstalk analysis of carbon nanotube bundle interconnects

Kailiang Zhang1*, Bo Tian1, Xiaosong Zhu1, Fang Wang1* and Jun Wei12

Author Affiliations

1 School of Electronics Information Engineering, Tianjin Key Laboratory of Film Electronic and Communication Devices, Tianjin University of Technology, Tianjin, 300384, China

2 Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Jurong, 638075, Singapore

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Nanoscale Research Letters 2012, 7:138  doi:10.1186/1556-276X-7-138

Published: 17 February 2012


Carbon nanotube (CNT) has been considered as an ideal interconnect material for replacing copper for future nanoscale IC technology due to its outstanding current carrying capability, thermal conductivity, and mechanical robustness. In this paper, crosstalk problems for single-walled carbon nanotube (SWCNT) bundle interconnects are investigated; the interconnect parameters for SWCNT bundle are calculated first, and then the equivalent circuit has been developed to perform the crosstalk analysis. Based on the simulation results using SPICE simulator, the voltage of the crosstalk-induced glitch can be reduced by decreasing the line length, increasing the spacing between adjacent lines, or increasing the diameter of SWCNT.

interconnects; carbon nanotube; bundles; simulation; crosstalk