Crosstalk analysis of carbon nanotube bundle interconnects
1 School of Electronics Information Engineering, Tianjin Key Laboratory of Film Electronic and Communication Devices, Tianjin University of Technology, Tianjin, 300384, China
2 Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Jurong, 638075, Singapore
Nanoscale Research Letters 2012, 7:138 doi:10.1186/1556-276X-7-138Published: 17 February 2012
Carbon nanotube (CNT) has been considered as an ideal interconnect material for replacing copper for future nanoscale IC technology due to its outstanding current carrying capability, thermal conductivity, and mechanical robustness. In this paper, crosstalk problems for single-walled carbon nanotube (SWCNT) bundle interconnects are investigated; the interconnect parameters for SWCNT bundle are calculated first, and then the equivalent circuit has been developed to perform the crosstalk analysis. Based on the simulation results using SPICE simulator, the voltage of the crosstalk-induced glitch can be reduced by decreasing the line length, increasing the spacing between adjacent lines, or increasing the diameter of SWCNT.