Figure 4.
The temperature dependence of the specific contact resistivity for all samples. Sample 1 (filled square): Ti/Al/Ti/Au; sample 2 (filled triangle): Ti/Al/Ni/Au;
sample 3 (filled circle): Ti/Al/Ta/Au; and sample 4 (empty circle): the optimized
Ti/Al/Ta/Au metallization ohmic pads in TLM test structure on various annealing temperatures.
Wang and Kim Nanoscale Research Letters 2012 7:107 doi:10.1186/1556-276X-7-107 |