Figure 5.

SEM images of the CNT bumps' morphology after top die removal. (a) CNT bumps on the carrier. (b) CNT bumps on the chip joined to the carrier bump in (a). (c) Magnified view of the bump. The vertical alignments of the CNTs are indications of the mechanical flexibility of CNTs.

Yap et al. Nanoscale Research Letters 2012 7:105   doi:10.1186/1556-276X-7-105
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