Figure 4.

SEM images of the CNT interconnection bump demonstrated using a flip chip concept. The dimensions of CNT bumps were 100 × 100 μm. (a) Die attached to the carrier at a tilted angle of 75°. (b) Magnified view of two CNT interconnection bumps. (c) CNT from the bottom carrier was observed to be touching the die substrate which is indicative of the connections made.

Yap et al. Nanoscale Research Letters 2012 7:105   doi:10.1186/1556-276X-7-105
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