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Carbon nanotube bumps for the flip chip packaging system

Chin Chong Yap, Christophe Brun, Dunlin Tan, Hong Li, Edwin Hang Tong Teo*, Dominique Baillargeat and Beng Kang Tay

Nanoscale Research Letters 2012, 7:105  doi:10.1186/1556-276X-7-105

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