Table 1 |
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Summary of studies on CHF of nanofluids in pool boiling |
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Reference |
Nanofluids |
Concentration |
Test heater |
CHF enhancement |
|
|
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|
[5] |
Al2O3 in water |
0.001-0.025 g/l |
Cu plate (10 × 10 mm2) |
200%, (19.9 kPa) |
|
[6] |
SiO2 (15, 50, 3,000 nm) in water |
0.5 vol.% |
NiCr wire (ϕ = 1 mm) |
60% |
|
[72] |
Al2O3 (38 nm) in water |
0.037 g/l |
Ti layer on glass |
70% |
|
[45] |
TiO2 (27, 85 nm) in water |
0.01-3 vol.% |
Cu plate |
50% |
|
[22] |
Al2O3 (70-260 nm), ZnO in water; Al2O3 in ethylene glycol |
- |
Cu plate |
200% |
|
[47] |
Al2O3 (47 nm) in water |
0.5-4 vol.% |
SS plate (4 × 100 mm2) |
50% |
|
[73] |
Gold (3 nm) in water, 2.3 kPa |
- |
Cu disk (1 cm2) |
180% |
|
SiO2 (10-20 nm) in ionic solution of water |
0.5 vol.% |
NiCr wire (ϕ = 0.32 mm) |
220-320% |
|
|
TiO2 (23 nm) |
10-5-10-1 vol.% |
NiCr wire (ϕ = 0.2 mm) |
100% |
|
|
Al2O3 (47 nm) in water |
Ti wire (ϕ = 0.25 mm) |
80% |
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|
SiO2 (10 nm) |
170% |
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|
Al2O3 (110-210 nm) |
10-3-10-1 vol.% |
SS wire (ϕ = 0.381 mm) |
50% |
|
|
ZrO2 (110-250 nm) in water |
75% |
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|
SiO2 (20-40 nm) |
80% |
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|
[20] |
CuO (30 nm) in water |
0.1-2.0 wt.% |
Cu plate (40 × 40 mm2); with grooves |
50%, (100 kPa) |
|
140%, (31.2 kPa) |
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|
220% (7.4 kPa) |
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|
[57] |
Al2O3 (45 nm) in water and ethanol |
0.001-10 g/l |
Glass, Au, and Cu surfaces |
40% |
|
[21] |
CuO (59 nm) and SiO2 (35 nm) in water and alcohol (C2H4OH) with SDBS surfactant |
0.2-2 wt.% |
Cu disk (ϕ = 20 mm) |
30% |
|
[19] |
Al2O3 (22.6, 46 nm) in water |
0.0006-0.01 g/l |
NiCr wire (ϕ = 0.64 mm) |
50% |
|
BiO2 (38 nm) |
33% |
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|
[23] |
Al2O3 (<25 nm) in water |
10-4-10-1 g/l |
Cu disk (ϕ = 10 and 15 mm) |
70% |
|
Ag (3, 10, 80, 150, 250 nm) |
35% |
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|
[35] |
Single-walled CNT in water with hydrochloric acid |
2 wt.% |
NiCr wire (ϕ = 0.32 mm) |
300% |
|
[74] |
Multi-walled CNT in water with PVP polymer |
10-4-10-2, 0.05 vol.% |
Cu plate (9.5 × 9.5 mm2) Ti wire (ϕ = 0.25 mm) |
200% (19.9 kPa) 140% (19.9 kPa) |
|
[36] |
Cu (10-20 nm) in water |
0.25, 0.5, 1.0 wt.% |
Plate (30 × 30 mm2) |
|
|
w/ SDS surfactant |
50% |
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|
w/o SDS surfactant |
-30% |
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|
[69] |
TiO2 (45 nm) and Al2O3 (47 nm) in water |
0.01 vol.% |
Cu and Ni disks (ϕ = 20 mm) |
40% |
|
Al2O3 (139 nm), CuO (143 nm), Diamond (86 nm) in water |
0.001-1 g/l |
Cu plate (10 × 10 mm2) |
80% |
|
|
[27] |
CNT in water with nitric acid for pH 6.5; |
0.5-4 wt.% |
Cu plate (40 × 40 mm2) |
60% (100 kPa) |
|
140% (31.2 kPa) |
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|
200% (7.4 kPa) |
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|
[63] |
Graphene in water |
0.001 vol.% |
NiCr wire |
84% |
|
Graphene-oxide in water |
179% |
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|
Al2O3 in water |
152% |
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|
|
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Kim Nanoscale Research Letters 2011 6:415 doi:10.1186/1556-276X-6-415 |
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