SpringerOpen Newsletter

Receive periodic news and updates relating to SpringerOpen.

Open Access Open Badges Correction

Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition

Wen-Yin Ko1, Wei-Hung Chen1, Ching-Yuan Cheng2 and Kuan-Jiuh Lin1*

Author Affiliations

1 Department of Chemistry, Center of Nanoscience and Nanotechnology, National Chung-Hsing University, 250, Kuo Kuang Rd., Taichung, 402, Taiwan, ROC

2 Experimental Facility Division, National Synchrotron Research Center, 101 Hsin-Ann Road, Hsinchu Science Park, Hsinchu, 30076, Taiwan, ROC

For all author emails, please log on.

Nanoscale Research Letters 2010, 5:795-795  doi:10.1007/s11671-010-9539-8

The electronic version of this article is the complete one and can be found online at:

Published:29 January 2010

© 2010 The Author(s)

Erratum to: Nanoscale Res Lett (2009) 4:1481–1485 DOI 10.1007/s11671-009-9424-5

Unfortunately, the corresponding author name has been misspelled in the published version this paper[1].

Instead of Kaun-Jiuh Lin it should be Kuan-Jiuh Lin.


  1. Ko Wen-Yin, Chen Wei-Hung, Cheng Cheng-Yuan, Lin Kuan-Jiuh: Architectural Growth of Cu Nanoparticles Through Electrodeposition.

    Nanoscale Research Letters 2009, 4(12):1481. PubMed Abstract | Publisher Full Text | PubMed Central Full Text OpenURL