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Architectural Growth of Cu Nanoparticles Through Electrodeposition

Wen-Yin Ko1, Wei-Hung Chen1, Ching-Yuan Cheng2 and Kaun-Jiuh Lin1*

Author Affiliations

1 Department of Chemistry, Center of Nanoscience and Nanotechnology, National Chung-Hsing University, 250, Kuo Kuang Rd., Taichung, 402, Taiwan, ROC

2 Experimental Facility Division, National Synchrotron Research Center, 101 Hsin-Ann Road, Hsinchu Science Park, Hsinchu, 30076, Taiwan, ROC

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Nanoscale Research Letters 2009, 4:1481-1485  doi:10.1007/s11671-009-9424-5

Published: 13 September 2009


Cu particles with different architectures such as pyramid, cube, and multipod have been successfully fabricated on the surface of Au films, which is the polycrystalline Au substrate with (111) domains, using the electrodeposition technique in the presence of the surface-capping reagents of dodecylbenzene sulfonic acid and poly(vinylpyrrolidone). Further, the growth evolution of pyramidal Cu nanoparticles was observed for the first time. We believe that our method might open new possibilities for fabricating nanomaterials of non-noble transition metals with various novel architectures, which can then potentially be utilized in applications such as biosensors, catalysis, photovoltaic cells, and electronic nanodevices.

Copper; Shape control; Electrochemistry; Nanostructure; Nanoparticles