Open Access Nano Ideas

Fabrication of CuO nanoparticle interlinked microsphere cages by solution method

JianQuan Qi1,2*, HuYong Tian2, LongTu Li1 and HelenLaiWah Chan2

Author Affiliations

1 Department of Materials Sciences and Engineering, Tsinghua University, Beijing, 100084, China

2 Department of Applied Physics and Materials Research Center, The Hong Kong Polytechnic University, Hong Kong, China

For all author emails, please log on.

Nanoscale Research Letters 2007, 2:107-111 doi:10.1007/s11671-007-9039-7


The electronic version of this article is the complete one and can be found online at:


Received:21 November 2006
Accepted:4 January 2007
Published:3 February 2007

© 2007 to the authors

Abstract

Here we report a very simple method to convert conventional CuO powders to nanoparticle interlinked microsphere cages by solution method. CuO is dissolved into aqueous ammonia, and the solution is diluted by alcohol and dip coating onto a glass substrate. Drying at 80 °C, the nanostructures with bunchy nanoparticles of Cu(OH)2can be formed. After the substrate immerges into the solution and we vaporize the solution, hollow microspheres can be formed onto the substrate. There are three phases in the as-prepared samples, monoclinic tenorite CuO, orthorhombic Cu(OH)2, and monoclinic carbonatodiamminecopper(II) (Cu(NH3)2CO3). After annealing at 150 °C, the products convert to CuO completely. At annealing temperature above 350 °C, the hollow microspheres became nanoparticle interlinked cages.

Keywords:
CuO; Microsphere; Narnoparticle

Nano Ideas

[1-37]

References

  1. Liu B, Zeng HC:

    J. Am. Chem. Soc.. 2004, 126(26):8124.

    COI number [1:CAS:528:DC%2BD2cXks1GisLk%3D]

    Publisher Full Text OpenURL

  2. Liang ZH, Zhu YJ:

    Chem. Lett.. 2005, 34(2):214.

    COI number [1:CAS:528:DC%2BD2MXhsVCis7o%3D]

    Publisher Full Text OpenURL

  3. Liu QY, Liu ZY, Fan J:

    Chinese. J. Catal.. 2005, 26(1):59. OpenURL

  4. Morales J, Sanchez L, Martin F, Ramos-Barrado J, Sanchez M:

    Thin. Solid.. 2005, 474(1–2):133.

    COI number [1:CAS:528:DC%2BD2cXhtFeit7fM]

    Publisher Full Text OpenURL

  5. Zhu YW, Yu T, Cheong FC, Xui XJ, Lim CT, Tan VBC, Thong JTL, Sow CH:

    Nanotechnology. 2005, 16(1):88.

    COI number [1:CAS:528:DC%2BD2MXitVaksLk%3D]

    Publisher Full Text OpenURL

  6. Chang Y, Teo JJ, Zeng HC:

    Langmuir. 2005, 21(3):1074.

    COI number [1:CAS:528:DC%2BD2MXkvFSnsw%3D%3D]

    Publisher Full Text OpenURL

  7. Suarez S, Martin JA, Yates M, Avila R, Blanco J:

    J. Catal.. 2005, 229(1):227.

    COI number [1:CAS:528:DC%2BD2MXjtFKq]

    Publisher Full Text OpenURL

  8. Hou HW, Xie Y, Li Q:

    Cryst. Growth Des.. 2005, 5(1):201.

    COI number [1:CAS:528:DC%2BD2cXpt1Cqs7Y%3D]

    Publisher Full Text OpenURL

  9. Yu T, Cheong FC, Sow CH:

    Nanotechnology. 2004, 15(12):1732.

    COI number [1:CAS:528:DC%2BD2MXhtFGitr4%3D]

    Publisher Full Text OpenURL

  10. Li SZ, Zhang H, Ji YJ, Yang DR:

    Nanotechnology. 2004, 15(11):1428.

    COI number [1:CAS:528:DC%2BD2MXhsV2gsw%3D%3D]

    Publisher Full Text OpenURL

  11. Xu CH, Woo CH, Shi SQ:

    Chem. Phys. Lett.. 2004, 399(1–3):62.

    COI number [1:CAS:528:DC%2BD2cXpvVels7s%3D]

    Publisher Full Text OpenURL

  12. Bennici S, Carniti P, Gervasini A:

    Catal. Lett.. 2004, 98(4):187.

    COI number [1:CAS:528:DC%2BD2cXhtVSkt7zL]

    Publisher Full Text OpenURL

  13. Lu CH, Qi LM, Yang JH, Zhang DY, Wu NZ, Ma JM:

    J. Phys. Chem. B. 2004, 108(46):17825.

    COI number [1:CAS:528:DC%2BD2cXoslSgt7k%3D]

    Publisher Full Text OpenURL

  14. Cao MH, Wang YH, Guo CX, Qi YJ, Hu Wang CW:

    J. NanoSci. Nanotech.. 2004, 4(7):824.

    COI number [1:CAS:528:DC%2BD2cXovVent7k%3D]

    Publisher Full Text OpenURL

  15. Zhu JW, Chen HQ, Liu HB, Yang XJ, Lu LD, Xin W:

    Mater. Sci. Engr. A. 2004, 384(1–2):172. Publisher Full Text OpenURL

  16. Liang ZH, Zhu YJ:

    Chem. Lett.. 2004, 33(10):1314.

    COI number [1:CAS:528:DC%2BD2cXosVyns78%3D]

    Publisher Full Text OpenURL

  17. Yang R, Gao L:

    Chem. Lett.. 2004, 33(9):1194.

    COI number [1:CAS:528:DC%2BD2cXnslSqsrk%3D]

    Publisher Full Text OpenURL

  18. Du GH, Van Tendeloo G:

    Chem. Phys. Lett.. 2004, 393(1–3):64.

    COI number [1:CAS:528:DC%2BD2cXlsFKgtbk%3D]

    Publisher Full Text OpenURL

  19. Musa AO, Akomolafe T, Carter MJ:

    Sol. Energ. Mater. Sol. C. 1998, 51:305.

    COI number [1:CAS:528:DyaK1cXhs1Krtrg%3D]

    Publisher Full Text OpenURL

  20. Muhibbullah M, Hakim MO, Choudhury MGM:

    Thin Solid Films. 2003, 423:103.

    COI number [1:CAS:528:DC%2BD38XpsFSrtrk%3D]

    Publisher Full Text OpenURL

  21. Ziolo J, Borsa F, Corti M, Rigamonti A, Parmigiani F:

    J. Appl. Phys.. 1990, 67:5864.

    COI number [1:CAS:528:DyaK3cXktlenurs%3D]

    Publisher Full Text OpenURL

  22. Huang TJ, Yu TC:

    Appl. Catal.. 1991, 71:275.

    COI number [1:CAS:528:DyaK3MXisFeis7g%3D]

    Publisher Full Text OpenURL

  23. Hamada H, Kintaichi Y, Sasaki M, Ito T, Tabata M:

    Appl. Catal.. 1991, 75:L1.

    COI number [1:CAS:528:DyaK3MXlsVWmsL8%3D]

    Publisher Full Text OpenURL

  24. He H, Bourges P, Sidis Y, Ulrich C, Regnault LP, Pailhes S, Berzigiarova NS, Kolesnikov NN, Keimer B:

    Science. 2002, 295:1045.

    COI number [1:CAS:528:DC%2BD38Xht1Grt7c%3D]

    Publisher Full Text OpenURL

  25. Lang KM, Madhavan V, Hoffman JE, Hudson EW, Eisaki H, Uchida S, Davis C:

    Nature. 2002, 415:412.

    COI number [1:CAS:528:DC%2BD38XhtVCgtrY%3D]

    Publisher Full Text OpenURL

  26. Novak P:

    Electrochim. Acta.. 1986, 31:1167.

    COI number [1:CAS:528:DyaL28Xls1Sktbs%3D]

    Publisher Full Text OpenURL

  27. Ortiz JR, Ogura T, Medina-Valtierra J, Acosta-Ortiz SE, Bosh P, de las Reyes JA, Lara VH:

    Appl. Surf. Sci.. 2001, 174:177. Publisher Full Text OpenURL

  28. Kharas KCC:

    Appl. Catal. B Environ.. 1993, 2:207.

    COI number [1:CAS:528:DyaK3sXksFGjsbo%3D]

    Publisher Full Text OpenURL

  29. Vasiliev RB, Rumyantseva MN, Yakovlev NV, Gaskov AM:

    Sens. Actua. B Chem.. 1998, 50:186. Publisher Full Text OpenURL

  30. Nakamura Y, Zhuang H, Kishimoto A, Okada O, Yanagida H:

    J Electrochem. Soc.. 1998, 145:632.

    COI number [1:CAS:528:DyaK1cXpsF2lsQ%3D%3D]

    Publisher Full Text OpenURL

  31. Kim DW, Park B, Chung JH, Hong KS:

    Jpn. J. Appl. Phys.. 2000, 39:2696.

    COI number [1:CAS:528:DC%2BD3cXjs12itrs%3D]

    Publisher Full Text OpenURL

  32. Zhengwei Pan, Zurong Dai, Zhonglin Wang:

    Science. 2000, 291:1947. OpenURL

  33. Zhou Y, Yu SH, Cui XP, Wang CY, Chen ZY:

    Chem. Mater.. 1999, 11:545. Publisher Full Text OpenURL

  34. Zhu JJ, Liu SW, Palchik O, Koltypin Y, Gedanken A:

    Langmuir. 2000, 16:6396.

    COI number [1:CAS:528:DC%2BD3cXks1WntL8%3D]

    Publisher Full Text OpenURL

  35. Du GH, Chen Q, Han PD, Peng LM:

    Phys. Rew. B. 2003, 67:035323. Publisher Full Text OpenURL

  36. Du GH, Peng LM, Chen Q, Zhang S, Zhou WZ:

    Appl. Phys. Lett.. 2003, 83:1638.

    COI number [1:CAS:528:DC%2BD3sXms1Cjsrk%3D]

    Publisher Full Text OpenURL

  37. Qi JQ, Zhang T, Lu M, Wang Y, Chen WP, Li LT, Chan HLW:

    Chem. Lett.. 2005, 34(2):180.

    COI number [1:CAS:528:DC%2BD2MXhsVCju7k%3D]

    Publisher Full Text OpenURL